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Plating & Surface treatment

Support for your cost down by plating

  • We support your cost down for plating, from design stage or prototype to mass production.
  • Based on our sufficient experience and knowledge, we propose you the optimum specifications of plating for your requirement and the most competitive maker in quality, price & delivery. Thus, we support you in an aspect of process.
  • We assist you to achieve cost down from the stage of designing.

We can provide you with pre-plating (plating on material), primary stamping and post-plating (plating on parts). We can promptly respond to any specifications or requirements for designing & prototype as well as for mass-production.


Example of Pre-plating

Example of Pre-plating

  1. We can make highly precise positioning of selective plating with pre-plating and that can minimize quantity of precious metal for plating and size of the parts.
  2. A big coil can save manpower for stamping.
  3. We can provide you with various kinds of plating to satisfy your requirement.

※ Please feel free to contact us for further requirement.

Example of Spot plating


  1. Minimizing quantity of precious metal enables to achieve cost down.
  2. Little limitation for plating spot to be located in the spool.
  3. We can provide you with primary stamping for precise positioning of the spot to be plated.

Lead free plating

We commit ourselves in our environmental policy to propose environment-friendly material & process method to customer. In the field of electronics industries, minimizing risk of whisker growth, solderability, adhesion strength, melting temperature are important factors to determine specifications for plating. Lead free plating processes which we propose are Sn Hot-Dip, Sn-Ag Hot-Dip, Sn Reflow, Sn Reflow with thick tin coating, Sn-Bi, Sn-Cu, etc.

【Lead Free Plating】
No Kinds of Lead Free Plating
2 Thick Sn reflow
3 Sn
4 Sn-Cu alloy
5 Sn-Bi alloy

Advantage of Sn Reflow with thick tin coating

Thickness of tin coating of the conventional Sn Reflow was 1.0 to 2.0 micron in general. Thin tin coating cannot assure good solderability and adhesion strength. On the other hand, the conventional Sn Reflow with thick tin coating had disadvantages such as quality of surface condition is not so good, fluctuation of coating thickness is big. Sn Reflow which we propose as a solution has the following features.

  • Maximum thickness of tin coating 5 micron (after reflow treatment)
  • Excellent solderability
  • Uniform distribution of thickness of tin coating and quality of surface is good having mirror gloss.
  • Reflow treatment minimize risk of whisker growth.

Example of plating after stamping

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  • Example of plating after stamping02
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  • We can propose Differential thickness plating (which can limit thick plating only for the place required so).
  • We can propose Pd-Ni alloy plating.
  • We can propose to provide selective Au plating after initial stamping to minimize quantity of Au.s

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