We can provide you with pre-plating (plating on material), primary stamping and post-plating (plating on parts). We can promptly respond to any specifications or requirements for designing & prototype as well as for mass-production.
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We commit ourselves in our environmental policy to propose environment-friendly material & process method to customer. In the field of electronics industries, minimizing risk of whisker growth, solderability, adhesion strength, melting temperature are important factors to determine specifications for plating. Lead free plating processes which we propose are Sn Hot-Dip, Sn-Ag Hot-Dip, Sn Reflow, Sn Reflow with thick tin coating, Sn-Bi, Sn-Cu, etc.
【Lead Free Plating】 | |
---|---|
No | Kinds of Lead Free Plating |
1 | Sn HOTDIP |
2 | Thick Sn reflow |
3 | Sn |
4 | Sn-Cu alloy |
5 | Sn-Bi alloy |
Thickness of tin coating of the conventional Sn Reflow was 1.0 to 2.0 micron in general. Thin tin coating cannot assure good solderability and adhesion strength. On the other hand, the conventional Sn Reflow with thick tin coating had disadvantages such as quality of surface condition is not so good, fluctuation of coating thickness is big. Sn Reflow which we propose as a solution has the following features.