No waste from production process.
No hazardous substance (such as cyanogens, lead, etc.) is used at all in production process.
Plating speed is very high (Several times higher than electrolytic plating.
Both thick coating and thin coating are produced at about same speed.
Thickness of tin layer is set by computer-controlled air knives system, a contact free process which ensures particularly high surface qualities.
Tin coating and base metal is strongly bonded as inter-metallic layer formed at Hot-Dip process.
The Inter-metallic layer has a function to seal zinc diffusion and to prevent dezincification in case base metal is brass.
Risk of whisker growth is very small since Hot-Dip process makes crystal structure of tin uniform and minimizes its inner stress. That minimizes risk of whisker growth.
Hot-Dip Tin Plating has wide variety such as one having high surface hardness or low, one having thick inter metallic layer or thin and so on.
We can propose Hot-Dip Tin Plating to respond any requirement.
Pure Tin layer |
Inter-metallic layer |
Base metal |
Inter-metallic layer |
Base metal |
Sn-Ag plating |
Inter-metallic layer |
Base metal |